期刊
Fengjiang Wang, DapengYang, Guoqing Yin,Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging, Soldering & Surface Mount Technology, 2024
王小伟,王凤江*.Sn-58Bi微焊点组织与力学性能的尺寸效应行为. 焊接学报，2023, 44: 70
Jiawei Chen, Mingqing Liao,Fengjiang Wang*. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging.Journal of Materials Science: Materials in Electronics, 2023, 34: 1558
Mingqing Liao, Hongshun Gong, Nan Qu,Fengjiang Wang*, Jingchuan Zhu, Zi-kui Liu. CALPHAD aided mechanical properties screening in full composition space of NbC-TiC-VC-ZrC ultra-high temperature ceramics. InternationalJournal of Refractory Metals and Hard Materials, 2023, 113: 106191
Mingqing Liao, Jumahan Maimaitimusha, Xueting Zhang, Jingchuan Zhu andFengjiang Wang*. P212121-C16: An ultrawide bandgap and ultrahard carbon allotrope with the bandgap larger than diamond.Frontiers of Physics, 2022, 17: 63507
杨蔚然, 季童童, 丁毓,王凤江*.热老化与热循环条件下Bi添加对Sn-1.0Ag-0.5Cu低银无铅焊点界面组织与性能的影响. 焊接学报，2022, 43: 157-162
董传淇,王凤江*. SnAgCu/SnBi混装焊点的热循环可靠性研究. 学报（自然科学版）, 2022 （已录用）
Su-juan Zhong, Liang Zhang, Mu-lan Li, Wei-min Long,Fengjiang Wang, Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties. Materials & Design, 2022, 215: 110439
姜楠, 张亮, 孙磊,王凤江, 龙伟民, 钟素娟. 热循环对Sn-58Bi-0.1Ti/Cu焊点界面与性能影响. 稀有金属材料与工程, 2022
Tongtong Ji, Chuanqi Dong, Hong Chen, Mingqing Liao,Fengjiang Wang*. Effect of Trace Zn addition on interfacial reaction and shear properties of Sn-10Bi solder on Ni substrate.Microelectronics Reliability, 2022 (be submitted)
Weiran Yang, Yu Ding, Mingqing Liao,Fengjiang Wang*. Effect of trace Ge on interfacial reaction and shear strength in Sn-0.7Cu solder joints during aging and thermal cycling.Journal of Materials Science: Materials in Electronics, 2022, 33: 17133-17151https://doi.org/10.1007/s10854-022-08589-9
Jun Wu,Fengjiang Wang*, Kaipeng Wang.Thermomigration behavior of Sn-Bi joints under different substrate.Journal of Materials Science: Materials in Electronics, 2022,33, pages8127–8139 https://doi.org/10.1007/s10854-022-07962-y
王凤江*,何其航.添加微量Zn对Sn-58Bi/Cu焊点老化过程中界面演变以及力学性能的影响.机械工程学报, 2022,58(2): 284-290
Mingqing Liao,Fengjiang Wang*, Jingchuan Zhu, Zhonghong Lai, Yong Liu. P2221-C8: A novel carbon allotrope denser than diamond.Scripta Materialia, 2022, 212: 114549
Kai Qi, Guo Xu andFengjiang Wang*. Interfacial behavior and shear strength of Al-25Si-4Cu-1Mg joints by transient liquid phase bonding with Cu as interlayer.Metals, 2021, 11: 1637
Fengjiang Wang, Amey Luktuke, Nikhilesh Chawla*. Microstructural coarsening and mechanical properties of eutectic Sn-58Bi solder joint during aging.Journal of Electronic Materials, 2021, 50: 6607-6614
Y. Wang, Z. Rao*, S. Liao,Fengjiang Wang. Ultrasonic welding of fiber reinforced thermoplastic composites: current understanding and challenges.Composites Part A, 2021, 149: 106578
Qingfeng Wang, Yu Ding,Fengjiang Wang*. Effect of nano ZnO addition on wettability and interfacial structure of Sn-based Pb-free solders on Aluminum.Materiali in Tehnologije (Materials and Technology), 2020, 54: 79-83 (IF = 0.84)
Qingfeng Wang, Hong Chen, Fengjiang Wang*. Effect of trace Zn addition on the interfacial evolution in Sn-10Bi/Cu solder joints during aging.Materials, 2019, 12(24): 4240 (IF = 2.972)
Kaipeng Wang,Fengjiang Wang*,Ying Huang, Kai Qi. Comprehensive properties of a novel quaternary Sn-Bi-Sb-Ag solder: wettability, interfacial structure and mechanical properties.Metals, 2019,9(7): 791 (IF = 2.259)
Dandan Feng,Fengjiang Wang*, Dongyang Li, Bin Wu, Luting Liu, Mingfang Wu.Atomic migration in Sn-58Bi solder from the interaction between electromigration and thermomigration.Materials Research Express, 2019,6: 046301 (IF = 1.220)
Fengjiang Wang*, Yu Ding, Luting Liu, Ying Huang, Mingfang Wu. Wettability, interfacial behavior and joint properties of Sn-15Bi solder.Journal of Electronic Materials, 2019, 48(10): 6835-6848 (IF = 1.64)
Fengjiang Wang*, Hong Chen, Ying Huang, Luting Liu, Zhijie Zhang. Recent progress on development of Sn-Bi based low-temperature Pb-free solders.Journal of Materials Science: Materials in Electronics, 2019, 30: 3222-3243 (IF = 2.324，ESI高被引)
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behaviors in Cu/molten Sn–58Bi/Cu solder joints under coupling with thermal and current stressing.Electronic Materials Letters, 2019, 15: 36-48 (IF = 2.882)
Fengjiang Wang*, Luting Liu, Dongyang Li, Mingfang Wu. Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures.Journal of Materials Science: Materials in Electronics, 2018,29: 21157-21169 (IF = 2.324)
Shuang Tian, Jian Zhou, Feng Xue, RuiHua Cao,Fengjiang Wang. Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding.Journal of Materials Science: Materials in Electronics, 2018,29: 13688-16400 (IF = 2.324)
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions.Journal of Materials Science: Materials in Electronics, 2018,29: 11409-11420 (IF = 2.324)
Fengjiang Wang*, Luting Liu, Mingfang Wu, Dongyang Li. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration.Journal of Materials Science: Materials in Electronics, 2018,29: 8895-8903 (IF = 2.324)
Fengjiang Wang*, Dongyang Li, Shuang Tian. Electromigration Reliability of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints.Microelectronics Reliability, 2017,73: 106-115 (IF = 1.236)
Fengjiang Wang*, Dongyang Li, Jiheng Wang, Xiaojing Wang, Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system,Journal of Materials Science: Materials in Electronics, 2017,28: 1631-1643 (IF = 2.324)
Fengjiang Wang*, Lili Zhou. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint.Journal of Electronic Materials, 2017,46: 6204-6213 (IF = 1.566)
Fengjiang Wang*,Ying Huang, Zhijie Zhang, Chao Yan. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.Materials, 2017,10: 920 (IF = 2.467)
Fengjiang Wang*, Luting Liu, Lili Zhou, Jiheng Wang, Mingfang Wu, Xiaojing Wang. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration.Materials Transactions, 2017,58: 1593-1600 (IF = 0.675)
Fengjiang Wang*, Dongyang Li, Zhijie Zhang, Mingfang Wu, Chao Yan. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier.Journal of Materials Science: Materials in Electronics, 2017,28: 19051-19060 (IF = 2.324)
Shuang Tian, Saiping Li, Jiang Zhou, Feng Xue, Ruihua Cao andFengjiang Wang. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints.Journal of Materials Science: Materials in Electronics, 2017,28: 16120-16132 (IF = 2.324)
Fengjiang Wang*, Lili Zhou, Xiaojing Wang, Peng He, Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging,Journal of Alloys and Compounds, 2016,688: 639-648 (IF = 3.779)
Fengjiang Wang*, Ying Huang. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test,Materials Science & Engineering A, 2016,668: 224-233 (IF = 3.414)
Shuang Tian,Fengjiang Wang*, Xiaojing Wang, Dongyang Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing,Materials Letters, 2016,172: 153-156 (IF = 2.687)
Fengjiang Wang, Matthew O’Keefe and Brandon Brinkmeyer. Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys.Journal of Alloys and Compounds,2009,477: 267-273
Fengjiang Wang, et al. Intermetallic compound formation at Sn-3.0Ag-0.5Cu- 1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions.Journal of Alloys and Compounds, 2007,438: 110-115.
Wang, HQ;Wang, FJ; Gao, F, et al. Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate.Journal of Alloys and Compounds, 2007,433: 302-305.
Fengjiang Wang, Feng Gao, Xin Ma, Yiyu Qian. Depressing effect of 0.2 wt% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging.Journal of Electronic Materials, 2006,35(10): 1818-1824.
Fengjiang Wang, Xin Ma and Yiyu Qian.Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition.Scripta Materialia, 2005,53: 699-702.
Fengjiang Wang, Xin Ma and Yiyu Qian. Rate-dependent indentation behavior of solder alloys.Journal of Materials Science,2005, 40: 1923-1928.
Fengjiang Wang, Xin Ma andYiyu Qian.Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball grid array (BGA) solder joint.Materials Science Forums, 2005,502: 399-404.
Xin Ma,Fengjiang Wang, Yiyu Qian and Fusahito Yoshida. Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface.Materials letters, 2003,57: 3361-3365.
王凤江,钱乙余,马鑫.微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能参数.中国有色金属学报, 2005, 15(5): 688-693.
王凤江,钱乙余,马鑫.纳米压痕法测量SnAgCu无铅钎料BGA焊点的力学性能参数.金属学报, 2005, 41(7) : 775-779.
会议文章
Fengjiang Wang, Dongyang Li. The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Ying Huang. The shear strength and fracture mode of Sn-xBi (x=0, 2.5, 5, 15)/Cu solder joints. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Zhiping Xiao. Electromigration behavior of liquid Sn-58Bi/Cu joints through minor Zn alloying substrates. ICEPT 2017, Aug. 16-19, Harbin, China
Fengjiang Wang, Matthew O’Keefe. Modeling of Pb-free BGA solder joint fatigue life during random vibration. TMS2010, Feb 14-18, 2010, Seattle, WA, USA.
Fengjiang Wang, Matthew O’Keefe. Effect of Surface Finish, Package Size, and Rework on Pb-free Solder Ball Grid Arrays during Thermal Cycling. TMS2009, Feb 15-19, San Francisco, CA, USA.
Fengjiang Wang, Matthew O’Keefe. Numerical and Experimental Analysis of Ball Grid Array Packages during Random Vibration. TMS2008, Mar 9-13, New Orleans, LA, USA.
Matthew O’Keefe,Fengjiang Wangand Brandon Brinkmeyer. Effect of Incorporating Eutectic Sn-Pb Solder on the Microstructure and Tensile Properties of SAC 305 Pb-free Solder. 2008 International Materials Research Conference, June, 9-12, 2008, Chongqing, China.
H.Q. Wang,F.J. Wang, X. Ma, J. Liu and Y.Y. Qian. Study on reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. The 6th International Conference on Electronics Packaging Technology, August 31-September 1, 2005, Shenzhen, China.
Fengjiang Wang, Xin Ma and Yiyu Qian. Indentation rate-dependent creep behavior of Sn-Ag-Cu Pb-free Ball Grid Array (BGA) solder joint. IPC/Soldertec 2nd international conference on lead-free electronics, June 22-23, 2004, Amsterdam, Netherlands.
F.J. Wang, X. Ma, Y.Y. Qian and F. Yoshida. A study on intermetallic compound layer development at Pb-free solder/Cu joint interfaces. Proceeding of the International Conference on Designing of Interfacial Structures in Advanced Materials and their Joints, Osaka Japan, 2002: 478-483.
王凤江,钱乙余.无铅钎料/Cu界面间金属学行为研究.钎焊及特种连接会议论文集, 2002
专利
王凤江.一种用于减少锡铋焊点金属间化合物形成的方法.国家发明专利, 201610592181.0
王凤江.一种凸点下金属化层构件及制备方法.国家发明专利, 201610953957.7
吴建雄,吴建新,马鑫,王凤江.具有抗氧化能力的无铅焊料.国家发明专利,专利号ZL 03 1 10895.4
吴建雄,吴建新,王凤江,刘军,王宏芹.波峰焊用无铅软钎焊料合金.国家发明专利,专利号ZL 03 1 11446.6