材料科学与工程学院
通讯地址：
个人邮箱：ray521252@163.com
邮政编码：212003
办公地点：新实验楼215/长山校区418
传真：
[1] J. Luan, Z. Cao, H. Lu, S. Dong, L. Wang, T. Tokoroyama, H. Ju, Silver-enhanced ZrN-MoSN composite films via magnetron sputtering: Insighting into the microstructure and optimizing self-lubricating properties, Surface and Coatings Technology, 524 (2026).通讯作者 二区
[2] X. Guo, Y. Yao, X. Sun, X. Ye, L. Jin, L. Wang, Y. Zhang, S. Dong, Microstructure modulation via ca doping enhances LaCoO3 supercapacitor electrochemical performance, Inorg Chim Acta, (2026).通讯作者 三区
[3] X. Guo, X. Sun, L. Wang, S. Dong, Y. Zhang, L. Jin, H. Ju, Sr@LCO application of double perovskite composites in supercapacitors, Chem Eng J, 527 (2026).通讯作者 一区
[4] X. Guo, Z. Tian, J. Qu, X. Ye, L. Wang, Y. Zhang, S. Dong, H. Ju, Enhanced the electrochemical performance in Sr-doped LaCoO3 nanofibers, J Alloy Compd, 1031 (2025).通讯作者 二区
[5] X. Guo, X. Sun, L. Wang, Y. Qiao, S. Dong, Investigation of the Structure and Electrochemical Performance of Perovskite Oxide La1−xCaxCrO3 Utilized as Electrode Materials for Supercapacitors, Coatings, 15 (2025).通讯作者 三区
[6] X. Guo, X. Sun, H. Ju, L. Jin, L. Wang, S. Dong, Facile synthesis of perovskite La2CoMnO6 nanoparticles for high-performance supercapacitor electrodes, Journal of Energy Storage, 130 (2025).通讯作者 二区
[7] L. Wang, X. Guo, S. Dong, Y. Qiao, J. Chen, Z. Yan, R. Shu, L. Jin, Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect, Coatings, 14 (2024).通讯作者 三区
[8] J. Zheng, H. Zhao, X. Guo, X. Jin, L. Wang, S. Dong, J. Chen, Enhanced Electrochemical Performance of LaMnO3 Nanoparticles by Ca/Sr Doping, Coatings, 14 (2023).通讯作者 三区
[9] B. Cheng, H. Chen, I. Asempah, J. Wang, Y. Zhu, J. Wan, F. Jiang, Z. Wang, Y. Shui, L. Wang, L. Jin, Y. Qiao, Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization, Coatings, 12 (2022).通讯作者 三区
[10] X. Li, B. Cheng, I. Asempah, Q. Shi, A.Q. Long, Y.L. Zhu, Q. Wang, Y.L. Li, L. Wang, L. Jin, Effect of Different Ni Contents on Thermal Stability of Cu(Ni) Alloy Film, J Electron Mater, 49 (2020) 5674-5680.通讯作者 三区
[11] L. Wang, I. Asempah, X. Li, S.-Q. Zang, Y.-F. Zhou, J. Ding, L. Jin, Indentation size effect in aqueous electrophoretic deposition zirconia dental ceramic, J Mater Res, 34 (2019) 555-562.通讯作者 三区
[12] L. Wang, I. Asempah, S.-T. Dong, P.-P. Yin, L. Jin, Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing, Appl Surf Sci, 399 (2017) 215-219.
[13] F. Wang, D. Li, Z. Zhang, M. Wu, C. Yan, Improvement on interfacial structure and properties of Sn–58Bi/Cu joint using Sn–3.0Ag–0.5Cu solder as barrier, Journal of Materials Science: Materials in Electronics, 28 (2017) 19051-19060.
[14] L. Wang, L. Jin, L.H. Yu, S.T. Dong, J. Chen, J.H. Xu, Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing, Appl Phys A-mater, 122 (2016) 1-5.
[15] L. Wang, J.H. Xu, L.H. Yu, S.T. Dong, Effect of Electric Field Intensity on Atom Diffusion in Cu/Ta/Si Stacks, (2015) 575-581.
[16] L. Wang, Z.H. Cao, J.H. Xu, L.H. Yu, T. Huang, X.K. Meng, Influence of electric field annealing on atom diffusion in Cu/Ta/Si stacks, Appl Phys A-mater, 114 (2014) 1091-1095.
[17] L. Wang, Z.H. Cao, J.A. Syed, K. Hu, Q.W. She, X.K. Meng, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochem Solid-State Lett, 15 (2012) H188.
[18] L. Wang, Z.H. Cao, K. Hu, Q.W. She, X.K. Meng, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Mater Chem Phys, 135 (2012) 806-809.
[19] L. Wang, Z.H. Cao, K. Hu, Q.W. She, X.K. Meng, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Appl Surf Sci, 257 (2011) 10845-10849.
1）长期从事铜互连结构界面扩散方面的研究。在阻挡层多层膜材料、铜合金材料制备，物性表征及理论研究方面具有多年的工作经验。主要研究课题为热/电场服役环境铜互连多层异质结构界面扩散行为研究，对铜互连多层膜结构制备以及原子迁移扩散行为有系统深入的研究。
2）纳米氧化锆齿科功能材料力学性能研究，主要关注材料纳米压痕尺度效应
3）调控钙钛矿晶体结构（如ABO₃型氧化物）优化离子/电子传输通道，开发具有高比表面积、优异电化学稳定性的电极材料，实现快速充放电与长循环寿命，适用于新能源汽车、智能电网及可穿戴设备等领域。
中国博士后基金资助项目面上资助一等，2016M602983，“水基电泳纳米义齿修复生物陶瓷增韧机制研究”，2017.1-2019.12，8万，在研，主持。
江苏省博士后基金资助项目A类，1601047A，“水基电泳纳米义齿修复生物陶瓷表面/梯度改性机制及工艺研究”，2016.9-2018.9，6万元，在研，主持。
国家自然科学基金青年项目,51501074，“热/电多场对自组装阻挡层铜互连结构界面扩散的影响机制”，2016/01-2018/12，21万元，在研，主持。
江苏省自然科学基金青年项目，BK20130468，“热/电场耦合对铜互连多层膜界面扩散的影响机制”，2013.7-2016.6，20万元，结题，主持。
Zheng, J., et al. (2023). Enhanced Electrochemical Performance of LaMnO3 Nanoparticles by Ca/Sr Doping. Coatings 14(1).
Zhang, Z. J., et al. (2022). Ultrahigh strengthening effect induced by element addition in nanostructural (TiVCr)100−xWx medium entropy alloy. Journal Of Alloys and Compounds 899.
Wang, L., et al. (2024). Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings 14(1).
Luan, J., et al. (2026). Silver-enhanced ZrN-MoSN composite films via magnetron sputtering: Insighting into the microstructure and optimizing self-lubricating properties. Surface and Coatings Technology 524.
Guo, X., et al. (2026). Microstructure modulation via ca doping enhances LaCoO3 supercapacitor electrochemical performance. Inorganica Chimica Acta.
Guo, X., et al. (2025). Enhanced the electrochemical performance in Sr-doped LaCoO3 nanofibers. Journal Of Alloys and Compounds 1031.
Guo, X., et al. (2025). Investigation of the Structure and Electrochemical Performance of Perovskite Oxide La1−xCaxCrO3 Utilized as Electrode Materials for Supercapacitors. Coatings 15(7).
Guo, X., et al. (2026). Sr@LCO application of double perovskite composites in supercapacitors. Chemical Engineering Journal 527.
Guo, X., et al. (2025). Facile synthesis of perovskite La2CoMnO6 nanoparticles for high-performance supercapacitor electrodes. Journal of Energy Storage 130.
Cheng, B., et al. (2022). Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization. Coatings 12(5).
Wang, Lei#, Xu Jun Hua, Yu Li Hua, Effect of electric field intensity on atom diffusion in Cu/Ta/Si stacks. In: TMS2015 Supplemental Proceedings, The Minerals, Metals & Materials Society, Wiley,
Hu, Kun, Cao, Zhen Hua, Wang, Lei, She, Qian Wei and Meng, Xiang Kang#, Annealing improved ductility and fracture toughness of nanocrystalline Cu films on flexible substrates, Journal of Physics D: Applied Physics, 2012, 45, 375305
Cao, Zhen Hua, Li, Pin Yun, Wang, Lei, Jiang, Zhao Hao and Meng, Xiang Kang#, A crossover from hardening to softening in nanocrystalline Ni by annealing and rolling, Applied Physics A, 2012, 109, 613-619
Cao, Zhen Hua, Wang, Lei, Hu, Kun, Huang, Yong Li. and Meng, Xiang Kang#, Microstructural evolution and its influence on creep and stress relaxation in nanocrystalline Ni, Acta Materialia, 2012, 60, 6742-6754
Wang, Lei#, Asempah, Isaac, Dong, Song-Tao, Yin, Pian-Pian, Jin, Lei#. Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Surface Science, 2017 399, 215-219
Wang, Lei#, Jin Lei, Yu Li Hua, Dong Song Tao, Chen Jian, Xu Jun Hua#. Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Physics A, 2015 122(1)
Wang, Lei#, Cao, Zhen Hua, Xu Jun Hua, Yu Li Hua, Huang Ting and Meng, Xiang Kang#, Influence of Electric Field Annealing on Atom Diffusion in Cu/Ta/Si Stacks, Applied Physics A, 2014, 114, 1092-1095
Wang, Lei, Cao, Zhen Hua, Syed, Junaid Ali, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochemical and Solid-State Letters, 2012, 15, H188-H191
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Materials Chemistry and Physics, 2012, 135, 806-809
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849
中国博士后基金资助项目面上资助一等，2016M602983，“水基电泳纳米义齿修复生物陶瓷增韧机制研究”，2017.1-2019.12，8万，在研，主持。
江苏省博士后基金资助项目A类，1601047A，“水基电泳纳米义齿修复生物陶瓷表面/梯度改性机制及工艺研究”，2016.9-2018.9，6万元，在研，主持。
国家自然科学基金青年项目,51501074，“热/电多场对自组装阻挡层铜互连结构界面扩散的影响机制”，2016/01-2018/12，21万元，在研，主持。
江苏省自然科学基金青年项目，BK20130468，“热/电场耦合对铜互连多层膜界面扩散的影响机制”，2013.7-2016.6，20万元，结题，主持。
Zheng, J., et al. (2023). Enhanced Electrochemical Performance of LaMnO3 Nanoparticles by Ca/Sr Doping. Coatings 14(1).
Zhang, Z. J., et al. (2022). Ultrahigh strengthening effect induced by element addition in nanostructural (TiVCr)100−xWx medium entropy alloy. Journal Of Alloys and Compounds 899.
Wang, L., et al. (2024). Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings 14(1).
Luan, J., et al. (2026). Silver-enhanced ZrN-MoSN composite films via magnetron sputtering: Insighting into the microstructure and optimizing self-lubricating properties. Surface and Coatings Technology 524.
Guo, X., et al. (2026). Microstructure modulation via ca doping enhances LaCoO3 supercapacitor electrochemical performance. Inorganica Chimica Acta.
Guo, X., et al. (2025). Enhanced the electrochemical performance in Sr-doped LaCoO3 nanofibers. Journal Of Alloys and Compounds 1031.
Guo, X., et al. (2025). Investigation of the Structure and Electrochemical Performance of Perovskite Oxide La1−xCaxCrO3 Utilized as Electrode Materials for Supercapacitors. Coatings 15(7).
Guo, X., et al. (2026). Sr@LCO application of double perovskite composites in supercapacitors. Chemical Engineering Journal 527.
Guo, X., et al. (2025). Facile synthesis of perovskite La2CoMnO6 nanoparticles for high-performance supercapacitor electrodes. Journal of Energy Storage 130.
Cheng, B., et al. (2022). Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization. Coatings 12(5).
Wang, Lei#, Xu Jun Hua, Yu Li Hua, Effect of electric field intensity on atom diffusion in Cu/Ta/Si stacks. In: TMS2015 Supplemental Proceedings, The Minerals, Metals & Materials Society, Wiley,
Hu, Kun, Cao, Zhen Hua, Wang, Lei, She, Qian Wei and Meng, Xiang Kang#, Annealing improved ductility and fracture toughness of nanocrystalline Cu films on flexible substrates, Journal of Physics D: Applied Physics, 2012, 45, 375305
Cao, Zhen Hua, Li, Pin Yun, Wang, Lei, Jiang, Zhao Hao and Meng, Xiang Kang#, A crossover from hardening to softening in nanocrystalline Ni by annealing and rolling, Applied Physics A, 2012, 109, 613-619
Cao, Zhen Hua, Wang, Lei, Hu, Kun, Huang, Yong Li. and Meng, Xiang Kang#, Microstructural evolution and its influence on creep and stress relaxation in nanocrystalline Ni, Acta Materialia, 2012, 60, 6742-6754
Wang, Lei#, Asempah, Isaac, Dong, Song-Tao, Yin, Pian-Pian, Jin, Lei#. Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Surface Science, 2017 399, 215-219
Wang, Lei#, Jin Lei, Yu Li Hua, Dong Song Tao, Chen Jian, Xu Jun Hua#. Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Physics A, 2015 122(1)
Wang, Lei#, Cao, Zhen Hua, Xu Jun Hua, Yu Li Hua, Huang Ting and Meng, Xiang Kang#, Influence of Electric Field Annealing on Atom Diffusion in Cu/Ta/Si Stacks, Applied Physics A, 2014, 114, 1092-1095
Wang, Lei, Cao, Zhen Hua, Syed, Junaid Ali, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochemical and Solid-State Letters, 2012, 15, H188-H191
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Materials Chemistry and Physics, 2012, 135, 806-809
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849
中国博士后基金资助项目面上资助一等，2016M602983，“水基电泳纳米义齿修复生物陶瓷增韧机制研究”，2017.1-2019.12，8万，在研，主持。
江苏省博士后基金资助项目A类，1601047A，“水基电泳纳米义齿修复生物陶瓷表面/梯度改性机制及工艺研究”，2016.9-2018.9，6万元，在研，主持。
国家自然科学基金青年项目,51501074，“热/电多场对自组装阻挡层铜互连结构界面扩散的影响机制”，2016/01-2018/12，21万元，在研，主持。
江苏省自然科学基金青年项目，BK20130468，“热/电场耦合对铜互连多层膜界面扩散的影响机制”，2013.7-2016.6，20万元，结题，主持。
Zheng, J., et al. (2023). Enhanced Electrochemical Performance of LaMnO3 Nanoparticles by Ca/Sr Doping. Coatings 14(1).
Zhang, Z. J., et al. (2022). Ultrahigh strengthening effect induced by element addition in nanostructural (TiVCr)100−xWx medium entropy alloy. Journal Of Alloys and Compounds 899.
Wang, L., et al. (2024). Effect of Carbon-Doped Cu(Ni) Alloy Film for Barrierless Copper Interconnect. Coatings 14(1).
Luan, J., et al. (2026). Silver-enhanced ZrN-MoSN composite films via magnetron sputtering: Insighting into the microstructure and optimizing self-lubricating properties. Surface and Coatings Technology 524.
Guo, X., et al. (2026). Microstructure modulation via ca doping enhances LaCoO3 supercapacitor electrochemical performance. Inorganica Chimica Acta.
Guo, X., et al. (2025). Enhanced the electrochemical performance in Sr-doped LaCoO3 nanofibers. Journal Of Alloys and Compounds 1031.
Guo, X., et al. (2025). Investigation of the Structure and Electrochemical Performance of Perovskite Oxide La1−xCaxCrO3 Utilized as Electrode Materials for Supercapacitors. Coatings 15(7).
Guo, X., et al. (2026). Sr@LCO application of double perovskite composites in supercapacitors. Chemical Engineering Journal 527.
Guo, X., et al. (2025). Facile synthesis of perovskite La2CoMnO6 nanoparticles for high-performance supercapacitor electrodes. Journal of Energy Storage 130.
Cheng, B., et al. (2022). Self-Formed Diffusion Layer in Cu(Re) Alloy Film for Barrierless Copper Metallization. Coatings 12(5).
Wang, Lei#, Xu Jun Hua, Yu Li Hua, Effect of electric field intensity on atom diffusion in Cu/Ta/Si stacks. In: TMS2015 Supplemental Proceedings, The Minerals, Metals & Materials Society, Wiley,
Hu, Kun, Cao, Zhen Hua, Wang, Lei, She, Qian Wei and Meng, Xiang Kang#, Annealing improved ductility and fracture toughness of nanocrystalline Cu films on flexible substrates, Journal of Physics D: Applied Physics, 2012, 45, 375305
Cao, Zhen Hua, Li, Pin Yun, Wang, Lei, Jiang, Zhao Hao and Meng, Xiang Kang#, A crossover from hardening to softening in nanocrystalline Ni by annealing and rolling, Applied Physics A, 2012, 109, 613-619
Cao, Zhen Hua, Wang, Lei, Hu, Kun, Huang, Yong Li. and Meng, Xiang Kang#, Microstructural evolution and its influence on creep and stress relaxation in nanocrystalline Ni, Acta Materialia, 2012, 60, 6742-6754
Wang, Lei#, Asempah, Isaac, Dong, Song-Tao, Yin, Pian-Pian, Jin, Lei#. Quantitative studies of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Surface Science, 2017 399, 215-219
Wang, Lei#, Jin Lei, Yu Li Hua, Dong Song Tao, Chen Jian, Xu Jun Hua#. Evaluation of electric field intensity on atom diffusion of Cu/Ta/Si stacks during annealing. Applied Physics A, 2015 122(1)
Wang, Lei#, Cao, Zhen Hua, Xu Jun Hua, Yu Li Hua, Huang Ting and Meng, Xiang Kang#, Influence of Electric Field Annealing on Atom Diffusion in Cu/Ta/Si Stacks, Applied Physics A, 2014, 114, 1092-1095
Wang, Lei, Cao, Zhen Hua, Syed, Junaid Ali, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing, Electrochemical and Solid-State Letters, 2012, 15, H188-H191
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Improved diffusion barrier performance of Ru/TaN bilayer by N effusion in TaN underlayer, Materials Chemistry and Physics, 2012, 135, 806-809
Wang, Lei, Cao, Zhen Hua, Hu, Kun, She, Qian Wei and Meng, Xiang Kang#, Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks, Applied Surface Science, 2011, 257, 10845-10849
2012/6 - 至今，raybey雷竞技 ，材料科学与工程学院，副教授
2015/11-至今，南京军区总医院，口腔科，博士后
2009/9 - 2012/6，南京大学，材料学，博士
2006/9 - 2009/4，raybey雷竞技 ，材料物理，硕士，
2002/9 - 2006/7，安徽大学，材料物理与化学，学士
半导体器件物理
固体物理
热处理原理
热处理工艺与设备
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学校地址：江苏省镇江市丹徒区长晖路666号
邮编：212100
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